Capability overview
Four lines, one battery program.
Every VoltBridge BBU passes through four in-house capability lines: BMS SMT, pack assembly, testing and aging, and OEM/ODM engineering. Each line is configured per project — board sets, module formats and market requirements differ too much for one generic batch quota.
The four lines
Pick a line to see what it builds.
BMS SMT
Control, cell-tap and telemetry boards for LFP packs, placed down to 01005 passives with AOI and conformal coating. Explore CAP-01 →
Pack Assembly
Graded 21700 LFP cells, laser-welded busbars and stacked modules for 19-inch rack shelves and server BBU hardware. Explore CAP-02 →
Testing & Aging
Formation and aging racks cycle every module against its project profile, backed by a UN 38.3 pre-compliance bench. Explore CAP-03 →
OEM / ODM
A six-gate custom program from RFQ to mass production: your brand on a proven 51.2V LFP platform. Explore CAP-04 →
Working with VoltBridge
From RFQ to ramp, one spec at a time.
The OEM path is a sequence of agreed gates, each producing something you can review: a platform recommendation, a frozen spec sheet, sample hardware, cycle data, then volume. Nothing advances on a verbal change.
- An RFQ with rack form factor, target market and volumes opens the program — everything after is spec-driven.
- The frozen spec sheet becomes the single reference for samples, validation and mass production.
- Samples are built on the line that will run mass production, so what you approve is what you scale.
- Pilot and mass-production gates close only when the previous gate's data review is signed off.
Map your build to the right line.
Tell us the rack form factor, the board set and the bridge-time target. We route it through the right capability lines and reply with a project plan inside two working days.
